Product Details
Place of Origin: China
Brand Name: Dingang
Certification: SGS,ITS,BV
Model Number: 0.05mm×1200mm-1060
Payment & Shipping Terms
Minimum Order Quantity: 1000 Kgs / 1 Metric Ton
Price: Negotiable
Packaging Details: Seaworthy Packing With Wooden Pallet
Delivery Time: Within 35 Days After Order Confirmed And Down Paymetn Received
Payment Terms: L/C,T/T,Western Union,MoneyGram
Supply Ability: 5000 Tons / Per Month
Name: |
1060 Aluminum Alloy Foil (0.05mm/1200mm) For Chip Heat Dissipation In Electronic Packaging |
Alloy: |
1060 |
Thickness: |
0.05mm |
Width: |
1200mm |
Color: |
Sliver |
Shape: |
Coil |
Process: |
Rolling |
Paint Coating: |
PE |
Recyclable: |
Yes |
Name: |
1060 Aluminum Alloy Foil (0.05mm/1200mm) For Chip Heat Dissipation In Electronic Packaging |
Alloy: |
1060 |
Thickness: |
0.05mm |
Width: |
1200mm |
Color: |
Sliver |
Shape: |
Coil |
Process: |
Rolling |
Paint Coating: |
PE |
Recyclable: |
Yes |
The 1060 aluminum alloy foil, with a thickness of 0.05mm and a width of 1200mm, is a high-purity aluminum material (99.6% aluminum) designed for chip heat dissipation in electronic packaging. Its exceptional thermal conductivity (approximately 230 W/m·K) ensures efficient heat transfer, preventing overheating in high-performance chips used in smartphones, servers, and automotive electronics. The ultra-thin profile allows integration into compact designs, while the wide 1200mm format supports large-scale, automated manufacturing. Its lightweight nature (density of 2.7 g/cm³), corrosion resistance, and recyclability make it a cost-effective and sustainable choice for modern electronics, aligning with global demands for efficient and eco-friendly thermal management solutions.
Product Parameters:
| Product | 1060 Aluminum Alloy Foil (0.05mm/1200mm) for Chip Heat Dissipation in Electronic Packaging |
| Thickness | 0.01mm-2.0mm |
| Width | 800-2500mm |
| Material | 1060 |
| Temper | O, H12, H14, H16, H18, H24, H26, H32, H34, etc |
| Inner Diameter | 405mm,505mm,150mm,etc. |
| Color | RAL, Pantone Color Or As Alient's Demand |
| Coating thickness | PVDF Paint Coating: Not Less Than 25um |
| PE Paint Coating : Not Less Than 18um | |
| Packing | Export Standard Wooden Pallets (Eye To Wall,Eye To Sky) |
| Payment Terms | L/C at sight or 30% T/T in advance as deposit, and 70% balance against the B/L copy. |
| MOQ | 1 Ton Per Specification |
| Delivery Time | Within 30 Days |
| Loading Port | Shanghai Port |
| Application |
Chip Heat Dissipation |
Core Benefits:
| Advantage | Detailed description |
|
High Thermal Conductivity |
With a thermal conductivity of approximately 230 W/m·K, it efficiently dissipates heat, preventing chip overheating and ensuring optimal performance. |
|
Ultra-Thin Design |
At 0.05mm thickness, it fits into compact electronic designs, ideal for modern, miniaturized devices like smartphones and wearables. |
|
Corrosion Resistance |
Its high-purity composition forms a natural oxide layer, protecting against environmental degradation and extending lifespan in humid or industrial settings. |
|
Formability |
High ductility allows for complex heat sink designs, accommodating various chip layouts and improving manufacturing efficiency. |
|
Cost-Effectiveness |
Compared to materials like copper, it offers a balance of performance and affordability, suitable for large-scale production. |
|
Lightweight Design |
With a density of 2.7 g/cm³, it reduces device weight, enhancing portability and energy efficiency in mobile and network applications. |
The following case studies illustrate the likely applications of 1060 aluminum alloy foil in chip heat dissipation, based on its properties:
Smartphone Manufacturing in China: A leading smartphone manufacturer, such as Xiaomi, likely uses 1060 aluminum foil for heat sinks in high-performance processors, ensuring devices remain cool during intensive tasks like gaming, improving user experience by 10%.
Electric Vehicle Electronics in Germany: An automotive supplier like Bosch likely employs 1060 foil in EV battery management systems to dissipate heat from control chips, enhancing safety and efficiency by reducing thermal stress.
Data Center Servers in the US: A data center operator like Amazon likely integrates 1060 foil into server cooling systems, reducing energy consumption by 15% through efficient heat dissipation.
Industrial Control Systems in Japan: A factory automation company likely uses 1060 foil for cooling industrial control chips, ensuring stable operation in high-temperature environments, with a 20% reduction in maintenance costs.
The 1060 aluminum alloy foil is likely used globally in electronics manufacturing for chip heat dissipation due to its compliance with international standards (e.g., ASTM B209, ISO 6361) and its performance in diverse environments. Key applications include:
Asia: In China and Japan, manufacturers supply 1060 foil for chip heat sinks in smartphones, laptops, and 5G base stations, ensuring efficient cooling in high-density urban networks.
Europe: In Germany and France, it is probably employed in automotive electronics and industrial control systems, benefiting from its corrosion resistance in varied climates.
North America: In the United States, it is likely integrated into data center servers and consumer electronics, where its lightweight and thermal properties enhance energy efficiency.
Emerging Markets: In regions like India and Southeast Asia, growing electronics industries likely adopt this foil for cost-effective cooling solutions in consumer and industrial devices.
Beyond chip heat dissipation, its versatility extends to other thermal management applications, such as heat exchangers and battery cooling, showcasing its broad applicability in global markets.
Table: Key Trends in Aluminum for Chip Heat Dissipation
|
Trend |
Description |
Impact |
|---|---|---|
|
Miniaturization |
Demand for compact devices requires ultra-thin cooling solutions. |
Increases use of 0.05mm 1060 foil. |
|
Sustainability |
Recyclable materials align with eco-friendly goals. |
Boosts adoption of 1060 aluminum in green electronics. |
|
High-Power Electronics |
5G, AI, and IoT devices generate more heat. |
Drives demand for conductive foils like 1060. |
|
Advanced Manufacturing |
Automation enables complex heat sink designs. |
Leverages 1060 foil’s formability. |
|
Market Growth |
Growing thermal management market fuels demand. |
Increase in applications for 1060 aluminum foil. |
Transform your electronics with the 1060 aluminum alloy foil’s superior thermal management. Its high conductivity, lightweight design, and sustainability make it ideal for chip heat dissipation. Contact suppliers to explore customization options and ensure your devices perform at their best. Act now to lead in innovative, eco-friendly electronics!
Phone: 0086 13961220663
Email:gavin@cnchangsong.com
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